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1 flip-chip bonding
1. монтаж кристаллов на подложке лицевой поверхности2. монтаж методом перевернутого кристаллаEnglish-Russian big polytechnic dictionary > flip-chip bonding
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2 flip-chip bonding
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3 flip-chip bonding
Большой англо-русский и русско-английский словарь > flip-chip bonding
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4 flip-chip bonding
Англо-русский словарь технических терминов > flip-chip bonding
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5 flip-chip bonding
1) Техника: монтаж кристаллов на подложке лицевой поверхности, монтаж методом перевёрнутого кристалла (выводами к подложке)2) Вычислительная техника: крепление методом перевёрнутого кристалла -
6 flip-chip bonding
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7 flip-chip bonding
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8 flip-chip bonding
The New English-Russian Dictionary of Radio-electronics > flip-chip bonding
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9 flip-chip bonding
English-Russian dictionary of computer science and programming > flip-chip bonding
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10 flip-chip bonding
English-Russian dictionary of microelectronics > flip-chip bonding
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11 flip-chip bonding technology
Микроэлектроника: технология монтажа методом перевёрнутого кристаллаУниверсальный англо-русский словарь > flip-chip bonding technology
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12 face-down flip-chip bonding
Вычислительная техника: крепление методом перевёрнутого кристаллаУниверсальный англо-русский словарь > face-down flip-chip bonding
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13 face-down flip-chip bonding
English-Russian information technology > face-down flip-chip bonding
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14 bonding
1) соединение, крепление, прикрепление
2) соединение сваркой, сварка;
соединение пайкой, пайка
3) соединение (короткой) перемычкой
4) металлизация ∙ ball bonding chip bonding die bonding face-down bonding flip-chip bonding laser bonding light pulse bonding spider bonding thermal bonding thermal compression bonding thermocompression bonding ultrasonic bonding wire bonding( физическое) (химическое) связь( техническое) соединение, (с) крепление, связывание bonding хранение товаров на таможне до уплаты пошлины ~ of imported goods хранение импортируемых товаров на складе таможни chip ~ вчт. крепление кристалла -
15 bonding
1) связь; соединение; сцепление3) связывание; склеивание || связывающий, связующий4) соединение ( прикрепление) пайкой или сваркой; монтаж; сборка6) эл. соединение (короткой) перемычкой•-
aircraft bonding
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atomic bonding
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automated bonding
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ball bonding
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beam-lead bonding
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bumped tape bonding
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cement bonding
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chip bonding
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chisel bonding
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cross bonding
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die bonding
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direct bonding
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discontinuous bonding
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electron-beam bonding
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energy pulse bonding
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eutectic bonding
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fabric-to-fabric bonding
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face-down bonding
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face bonding
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face-up bonding
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fiber-to-resin bonding
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film-carrier bonding
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flip-chip bonding
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fusion bonding
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gang bonding
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gang lead bonding
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laser bonding
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lead bonding
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metallic bonding
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nonpolar covalent molecular bonding
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polar covalent molecular bonding
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rail bonding
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sheath bonding
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spider bonding
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stitch bonding
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strong bonding
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tailless bonding
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tape automated bonding
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TC bird beak bonding
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thermal bonding
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thermal-compression bonding
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thermal-pulse bonding
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thermosonic bonding
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ultrasonic bonding
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van der Waals bondings
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wire bonding
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wire-post bonding -
16 bonding
1) (при)соединение; прикрепление2) термокомпрессионная сварка, термокомпрессия3) соединение пайкой, пайка; соединение сваркой, сварка4) заземление (напр. аппаратуры)•- area array tape-automated bonding
- ball bonding
- batch bonding
- beam-lead bonding
- chip bonding
- coherent light bonding
- die bonding
- diffusion bonding
- epoxy bonding
- eutectic bonding
- explosive bonding
- face-down bonding
- face-up bonding
- flip-chip bonding
- friction bonding
- gang bonding
- impulse bonding
- laser bonding
- optical-contact bonding
- solder bonding
- spider bonding
- stitch bonding
- tape-automated bonding
- tape-automatic bonding
- TC bonding
- TC bird beak bonding
- thermal-compression bonding
- thermal-pulse bonding
- thermocompression bonding
- ultrasonic bonding
- wedge bonding
- wire bonding -
17 bonding
1) (при)соединение; прикрепление2) термокомпрессионная сварка, термокомпрессия3) соединение пайкой, пайка; соединение сваркой, сварка4) заземление (напр. аппаратуры)•- area array tape-automated bonding
- ball bonding
- batch bonding
- beam-lead bonding
- chip bonding
- coherent light bonding
- die bonding
- diffusion bonding
- epoxy bonding
- eutectic bonding
- explosive bonding
- face-down bonding
- face-up bonding
- flip-chip bonding
- friction bonding
- gang bonding
- impulse bonding
- laser bonding
- optical-contact bonding
- solder bonding
- spider bonding
- stitch bonding
- tape-automated bonding
- tape-automatic bonding
- TC bird beak bonding
- TC bonding
- thermal-compression bonding
- thermal-pulse bonding
- thermocompression bonding
- ultrasonic bonding
- wedge bonding
- wire bondingThe New English-Russian Dictionary of Radio-electronics > bonding
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18 bonding
1) соединение, крепление, прикрепление2) соединение сваркой, сварка; соединение пайкой, пайка4) металлизация•- chip bonding
- die bonding
- face-down bonding
- flip-chip bonding
- laser bonding
- light pulse bonding
- spider bonding
- thermal bonding
- thermal compression bonding
- thermocompression bonding
- ultrasonic bonding
- wire bondingEnglish-Russian dictionary of computer science and programming > bonding
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19 facedown bonding
English-Russian dictionary of Information technology > facedown bonding
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20 technique
2) технология; (технологический) приём3) алгоритм4) оборудование; технические средства; техника•-
active neutron technique
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Afmag technique
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airborne technique
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air-conditioning technique
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alignment technique
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alloy-diffusion technique
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anchoring technique
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angled-lapping technique
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angle-lapping technique
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angled-lap technique
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angle-lap technique
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apertured-detector technique
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arc-melting technique
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assembly technique
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audio record cutting technique
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audio-frequency magnetic technique
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batch-fabrication technique
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batch technique
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beam-lead microcircuit technique
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birefringent coating technique
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bonding technique
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brittle coating technique
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broadside technique
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BTR technique
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carbon extraction technique
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cementing technique
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check summation technique
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check sum technique
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chemiluminescence technique
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cine technique
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circuit technique
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CM technique
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collector-diffusion isolation technique
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computer simulation techniques
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computing technique
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conformable masking technique
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coring technique
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cryogenic technique
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crystal growth technique
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crystal-pulling technique
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curing technique
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curve-fitting technique
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Czochralski growth technique
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Czochralski technique
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decoration technique
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design technique
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destructive inspection technique
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diffusion technique
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direct writing technique
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diversity technique
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doping technique
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dot-and-dash technique
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double-specimen technique
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double-theodolite technique
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drilling technique
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dry etching technique
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dry etch technique
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echo-sounding technique
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editing technique
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electrodeless technique
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electron channeling technique
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electron-ion storage technique
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electroplating technique
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encapsulation technique
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energy conservation technique
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energy conversion technique
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epitaxial growth technique
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epitaxial technique
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etching technique
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etch technique
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evaporation technique
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expanding-spread technique
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fabrication technique
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face-down technique
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Fane knit technique
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figure-of-eight technique
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film technique
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film-carrier technique
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fine-line technique
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fixed-abrasive machining technique
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flip-chip technique
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floating-zone technique
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float-zone technique
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floating-charge technique
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flood routing technique
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fluidization technique
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folded-spectrum technique
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forecasting technique
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fracture replica technique
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freezing technique
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gamma-ray technique
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geomagnetic induction technique
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graphical design technique
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gravity anchoring technique
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growing technique
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head space technique
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heat pulse technique
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heuristic technique
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high-speed motion-picture technique
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high-tech machining technique
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high-vacuum technique
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high-voltage technique
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high-voltage testing technique
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high-voltage test technique
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holographic technique
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horizontal stacking technique
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hyperflow technique
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imaging technique
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in-cycle gaging technique
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infrared nondestructive technique
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in-process gaging technique
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integrated-circuit technique
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integrated technique
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interconnection technique
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interference technique
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ion implantation technique
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ion-exchange technique
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isolation technique
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isotope correlation technique
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job setting technique
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junction isolation technique
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ladle-degassing technique
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layout technique
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lift-off technique
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lithographic technique
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long-hole technique
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loose-abrasive machining technique
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manufacturing technique
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mask technique
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masking technique
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mass-flow technique
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mass-spectrometric technique
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matrix technique
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microalloy technique
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microelectronic technique
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microfabrication technique
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microprobe technique
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microscopic technique
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microstructure fabrication technique
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microstructure technique
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mid-depth tow technique
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motion-picture technique
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mounting technique
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multicamera technique
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multichip bonding technique
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multiple seismometer technique
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multiple-access technique
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near-bottom tow technique
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nondestructive inspection technique
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normal-freezing technique
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observing technique
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optimizing technique
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ordered elimination technique
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overlay technique
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packaging technique
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parallel-line technique
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parts classification technique
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pattern recognition technique
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pattern-defining technique
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phase separation and leaching technique
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photoelastic technique
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photofinishing technique
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photographic technique
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photolithographic technique
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photoprocessing technique
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photoresist-processing technique
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piled anchoring technique
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piled/gravity anchoring technique
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pilot technique
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potential-drop-ratio technique
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preferential etching technique
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preferential etch technique
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printed-circuit technique
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probe technique
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processing technique
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production technique
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program production technique
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programming technique
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projection technique
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pulse-echo technique
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pyrometric technique
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radioactive tracer technique
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radio-echo technique
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ramp assisted toil casting technique
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refrigeration technique
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registration technique
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reocasting technique
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replica technique
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river-basin simulation technique
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robotic handling techniques
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roll-and-scroll technique
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roll technique
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round-robin technique
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screen-printing technique
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selective ion etching technique
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selective ion etch technique
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self-synchronization technique
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side-wall neutron technique
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silk-screening technique
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simulation technique
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spill-cleaning technique
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spin-on technique
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sputtering technique
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stimulation technique
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strain anneal technique
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structural arrest technique
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suction anchoring technique
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surface passivation technique
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tape-automated-bonding technique
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technique of directional crystallization
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technique of mold reciprocation
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television production technique
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television technique
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testing technique
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thermocompression technique
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through-flow line servicing technique
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time-lapse technique
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touch trigger probing technique
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tribometric technique
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two-point technique
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ultrahigh-vacuum technique
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unmanned production technique
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vacuum technique
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vapor-phase epitaxial technique
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vertical crystal pulling technique
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vertical pulling technique
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video tape editing technique
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voltage balancing technique
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water allocation technique
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water injection-fume exhaustion technique
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water-system optimization technique
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wet etching technique
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wet etch technique
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wire-line technique
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zone-melting technique
См. также в других словарях:
flip-chip bonding — apverstųjų lustų montavimas statusas T sritis radioelektronika atitikmenys: angl. flip chip bonding; flip chip mounting; inboard chip bonding vok. Flip Chip Montage, f rus. монтаж способом перевёрнутого кристалла ИС, m pranc. montage en face… … Radioelektronikos terminų žodynas
Flip-Chip-Montage — apverstųjų lustų montavimas statusas T sritis radioelektronika atitikmenys: angl. flip chip bonding; flip chip mounting; inboard chip bonding vok. Flip Chip Montage, f rus. монтаж способом перевёрнутого кристалла ИС, m pranc. montage en face… … Radioelektronikos terminų žodynas
flip-chip mounting — apverstųjų lustų montavimas statusas T sritis radioelektronika atitikmenys: angl. flip chip bonding; flip chip mounting; inboard chip bonding vok. Flip Chip Montage, f rus. монтаж способом перевёрнутого кристалла ИС, m pranc. montage en face… … Radioelektronikos terminų žodynas
Flip chip — Flip chip, also known as Controlled Collapse Chip Connection or its acronym, C4, is a method for interconnecting semiconductor devices, such as IC chips and MEMS, to external circuitry with solder bumps that have been deposited onto the chip pads … Wikipedia
inboard chip bonding — apverstųjų lustų montavimas statusas T sritis radioelektronika atitikmenys: angl. flip chip bonding; flip chip mounting; inboard chip bonding vok. Flip Chip Montage, f rus. монтаж способом перевёрнутого кристалла ИС, m pranc. montage en face… … Radioelektronikos terminų žodynas
Flip-Chip-Montage — Prozessor im Flip Chip Pin Grid Array Gehäuse Die Flip Chip Montage (dt. „Wende Montage“) ist ein Verfahren der Aufbau und Verbindungstechnik (AVT) zur Kontaktierung von ungehäusten Halbleiter Chips (engl. bare die) mittels Kontaktierhügel –… … Deutsch Wikipedia
Flip Chip — Die Flip Chip Montage (dt. „Wende Montage“) ist ein Verfahren der Aufbau und Verbindungstechnik (AVT) zur Kontaktierung von ungehäusten Halbleiter Chips (engl. bare die) mittels Kontaktierhügel − sogenannter „Bumps“. Bei der Flip Chip Montage… … Deutsch Wikipedia
Flip-Chip — Puce retournée Flip chip … Wikipédia en Français
Flip Chip — Puce retournée Flip chip … Wikipédia en Français
montage par méthode flip-chip — apverstųjų lustų montavimas statusas T sritis radioelektronika atitikmenys: angl. flip chip bonding; flip chip mounting; inboard chip bonding vok. Flip Chip Montage, f rus. монтаж способом перевёрнутого кристалла ИС, m pranc. montage en face… … Radioelektronikos terminų žodynas
Chip-On-Board-Technologie — Beispiel eines LCD Moduls, welches in COB Technologie ausgeführt ist Die Chip on Board Technologie (Abk.: COB, deutsch Nacktchipmontage) ist eine Technologie zur Direktmontage von ungehäusten Halbleiter Chips auf Leiterplatten zu einer… … Deutsch Wikipedia
